Canteliver Probe Card
MPI Cantilever Probe Card is extensively utilized on gold bump and pad wafer tests for display driver, logic, and memory unit. MPI’s cantilever probes are the corresponding reply on the calls for of fine pitch, smaller pad sizing, high speed, considerably less cleansing, multi-DUT, substantial pin rely, and ultra-lower leakage necessities. With superb craftsmanship, revolutionary architecture and verified methodologies determined by mechanical and electrical simulation/measurement benefits, generating MPI the highest cantilever supplier around the world.
FCB Probe Card
The FCB Probe Card is among the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-sector (TTM) and price of take a look at (COT) need. FCB is really a proven solution for several different semiconductor generation exams from early engineering pilot-runs to high quantity manufacturing (HVM). FCB is prepared for product necessitating high sign integrity probing (SI) and/or electricity integrity probing (PI). Programs involve slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the whole world’s ideal General Price tag-of-ownership (COO) for various DUT apps.
EVS Probe Card
The EVS Probe Card is an enhancement over the traditional buckling click here beam probe card. Important options are increased current carrying ability (C.C.C.) and reduce well balanced Get in touch with drive (BCF), along with In general MEMS-like attributes. EVS can easily meet up with the requirement of State-of-the-art wafer probing. Precise alignment and exceptional planarity control tend to be the important components contributing to stable Get in touch with resistance. With its ability and performance, EVS Probe Card is a great option for advanced probe cards.
Osprey probe card
The Osprey probe card is MPI’s solution to demand from customers for ever finer pitch. It truly is suitable for smaller sized Al pad, and is also ideal for very small pitch software with peripheral and comprehensive array pattern. With precise alignment and far better planarity Regulate, Osprey can reach greater productiveness by multi-DUT layout. The forming wire (FW) style needle produced with MPI’s personal micro fabrication method not simply provides significant-high quality overall performance but will also allows simple needle substitute and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle which can be made for the need of minimal power probing. In addition, it comes with the ability to fulfill superior C.C.C. and superior pin counts software. The MEMS course of action makes certain hugely steady needle qualities, as well as the Unique structure structure permits exact alignment and planarity Manage.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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